Responsibilities
- Responsible for ensuring products produced meet the product and customers' quality requirement
- Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
- Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
- Responsible for supporting and resolving daily technical issues in operations
- Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.
Requirements
- Min Diploma in Electronic Engineering, Material Science or relevant
- Min 5 years of working experience in semicon assembly and test environment
- Experience in Assembly FOL of dicing, die attach, wire bond
- Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing
Please kindly email your resume in Ms Word to [email protected]
We regret to inform that only shortlisted candidates would be notified.
Registration Number: R1328870
EA License No. 22C1026
