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Jobs in Singapore   »   Jobs in Singapore   »   Science / R&D / Research Job   »   Senior R&D Engineer (BGA, Wafer Bump) x2
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Senior R&D Engineer (BGA, Wafer Bump) x2

Randstad Pte. Limited

Job Description

  • Monitor performance throughout production cycle by following specification.
  • Using statistical method (SPC, six sigma) to ensure process control and monitoring.
  • Perform process matric (Design of Experiments and ANOVA) to investigate problems and support process improvements.
  • Initiate continuous quality improvement plans.
  • Interact with production, equipment engineering, and quality assurance team to address customer feedback and quality issues.
  • Strictly and consistently comply with NPI and Operations procedures
  • Liase with internal and external stakeholders

Job Requirements

  • At least 5 years experience in Semiconductor (Packaging) Industry
  • Back-End, with special focus on BGA, Bumping processes
  • Good knowledge of Physics, Chemistry and Material Science
  • Knowledge on physical characterization
  • Knowledge of Design of Experiments (DOE)

If you are interested in the position, kindly send your CVs to sean.ho(@)randstad.com.sg

Please include your availability, expected salary and reason for leaving your current job.

We regret that only shortlisted candidates will be contacted. Applicants must be fully vaccinated or have a valid exemption in accordance with MOM’s regulations to allow them to enter the workplace. Applicants may be required to share verifiable COVID-19 vaccination documents or proof of a valid exemption at the point of offer. Randstad Pte. Limited and/or the Client reserves the right to withdraw an offer if the applicant fails to provide verifiable COVID-19 vaccination and/or proof of exemption documents.

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