- Responsible for designing/ implementing packaging process of new isolation products.
- Evaluates reliability of materials, properties and techniques, explore new process methodology used in production.
- Perform Design of Engineering Experiment (DOE) and optimization of new developed processes.
- Carry out R&D programs with IC designer, product engineer and manufacturing team, various support functions and contract Manufacturer to develop and perform process validation of new devices.
- Perform process yield analysis and failure investigation of new device issues.
- Plan and carry out engineering programs to achieve cost targets, breakthrough improvement in manufacturing yield, quality and reliability
Requirement:
- We are looking for an experienced R&D process engineer (Optocoupler).
- We need people with a strong ME background, semiconductor packaging process development skill. e.g. Die Attach, Wire bond, encapsulation Molding, package trim/forming, vision inspection tools
- Demonstrated and proven analytical/ critical thinking, problem solving and solution provider.
- Familiarized with mechanical lead-frame design rules/ tools, knowledge in semiconductor physical failure analysis.
- Experience in IC packaging, high voltage isolation requirements, material and processing techniques.
- Roles in NPI project leadership, taking product from verification/ qualification to high volume soft launch is advantageous.
