Key Responsibilities:
- The Packaging Technology R&D Director will be a key team leader and an architect of advanced package pathfinding and technology development.
- The position will lead a technology office to be responsible for next generation technology roadmap and evolvement of wafer level and advanced packaging technologies including 2.5D and 3D structures.
- Candidate should have a passion of innovation and invention to create solutions and would be key IP contributor.
- Previous hands-on experiences in leading cross-functional teams by technical expertise to bring solutions to new products is required.
- Successful candidate should have experience with innovation incumbent, design, characterization, and volume production for high-performance, high-volume semiconductor devices.
- Candidate should have extensive direct experience in new process and material development for innovative packages.
- Close collaboration with customers and supply chain ecosystem is also required.
Key Qualifications:
- Ph.D. in mechanical, electrical or material engineering + 15 years is required
- Prior experience in advanced packaging (2.5D/3D, WLP, FC, SiP)
- Good understanding of chiplet architecture
- Experience in design, simulation (electrical, mechanical and thermal) of advanced package is preferred
- IC package or system product design experience is preferred though not required
- Possess strong communication skills, experience with global team members of different cultural backgrounds.
