[Job ID:612866]
Responsibilities :
- Lead backend material innovation projects, focusing on lead frame base material and finishing processes/compositions.
- Serve as a subject matter expert to troubleshoot problems in backend packaging projects globally.
- Contribute to the development of Infineon's backend material innovation roadmap from conceptualization to execution.
- Participate in the development and implementation of strategies related to lead frames and surface treatments (e.g., plating, lead frame processes, wire bonding).
- Contribute to the intellectual property (IP) strategy, including IP creation and fostering innovation.
- Collaborate cross-functionally with multiple departments to implement projects effectively.
- Undertake any other ad-hoc duties as assigned.
Requirements:
- Minimum of 10 years of work experience in relevant fields, including backend semiconductor processes, lead frame processes, and metals.
- Extensive technical expertise in semiconductor backend packaging, particularly in lead frame base materials and finishing.
- Strong presentation skills and excellent networking abilities.
- Willingness to occasionally travel for business purposes (5-10%).
We regret that only shortlisted candidates will be notified. However, rest assured that all applications will be updated to our resume bank for future opportunities
Please kindly refer to the Private Policy of Good Job Creations for your reference: https://goodjobcreations.com.sg/en/privacy-policy/
EA Personnel Name: Wong Slaine
EA Personnel Reg. no.: R2096245
EA License no.: 07C5771
